Sale!

Mild Facial Chemical Exfoliant – Skin Care Products

Original price was: $19.25.Current price is: $5.77.

Select:

SKU: SK0096183-US20260630-111630 Category:

Description

Age:18+
Brand:Bondi Sands
Line:Face Care
Product Type:Face Exfoliant
Product Properties:Anti Dark Spots, Cleansing, Exfoliating, Peeling, Smoothing
Volume:30 ml
Formula:Gentle
When To Use:Universal
Gender:For women
Classification:Professional
Skin Type:All Types
Country:Australia
Made in:Australia

The Bondi Sands Buff’n Polish Gentle Chemical Exfoliant is a skincare product from the Australian brand Bondi Sands designed to keep your facial skin clean, smooth, and healthy. This is not an aggressive peel but a gentle solution that removes dead skin cells, impurities, and excess sebum using mild acids. It is made with safe and natural ingredients that not only cleanse the skin but also nourish and hydrate it.

Key Features of the Bondi Sands Buff’n Polish Gentle Chemical Exfoliant:

– Contains lactic AHA acid with a low concentration that does not irritate the epidermis, dissolves the bonds between dead skin cells, stimulates skin renewal, and improves its texture;
– Reduces the appearance of wrinkles, pigmentation spots, and enlarged pores, and also protects the skin from the negative effects of the environment thanks to the antioxidant, anti-inflammatory, and moisturizing actions of gluconolactone PHA acid;
– Enriched with sakura extract, which has a toning, refreshing, and soothing effect, making the skin more elastic and soft;
– Contains aloe vera extract – a unique plant known for its healing, moisturizing properties, stimulates regenerative processes in the epidermis, soothes irritated skin, reduces inflammation, and improves blood microcirculation.

Gently massage a small amount of serum into clean skin, tapping with your fingertips. Follow with your favorite night/day skincare routine. Use 1-3 times per week.

Reviews

There are no reviews yet.

Be the first to review “Mild Facial Chemical Exfoliant – Skin Care Products”

Your email address will not be published. Required fields are marked *